Testing
GENTECH’s rigorous testing procedures and advanced equipment guarantee the reliability and performance of your electronic products through expert PCBA testing.
GENTECH offers various testing options, some are our standard tests and some are customized according to customer needs. They are solder paste inspection, automatic optical inspection, in circuit test, xray inspection, burn in test, vibration test, ESD test, Lighting color and intensity measurement test, temperature and humidity test and customized functional test.
Solder Paste Inspection (SPI)
Solder Paste Inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board. It is standard test after solder paste printing.
Automatic Optical Inspection
Automatic Optical Inspection is a visual quality method. It is our standard test after soldering, each board will be performed 100% by automatic optical inspection after soldering.
In Circuit Test (ICT)
In Circuit Test (ICT) checks for shorts, opens, resistance, capacitance, and other basic quantities to ensurethe assembly was correctly fabricated. GENTECH can build the in circuit test jig and perform in circuit test according to customers’ requirements.
Xray inspection
Xray inspection helps to look through the solder joint underneath the components. It is our in-process control on BGA inspection.
Customized Functional Test
GENTECH designs and manufactures functional test fixtures and testing programs used for performance verification of PCBs and Electronic Assemblies. They are custom-made testing according to our customers’ needs.